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基于HTCC的微波毫米波组件过渡结构的仿真设计
Simulation design of HTCC-based transition structures for microwave millimeter-wave components
【Author】 Zhengran Wang;Zhigang Wang;University of Electronic Science and Technology of China;
【机构】 电子科技大学;
【摘要】 针对毫米波频段相控阵收发组件中的信号传输问题,本文基于HTCC技术,对输入端和输出端分别设计了两种互联过渡结构。通过设计和调整模型的结构和大小,调节各结构间的阻抗匹配关系,使得射频信号在射频链路中实现低损耗的传输。本文利用三维电磁仿真软件对设计的结构进行了建模和仿真,使其在30GHz-40GHz的毫米波频段中回波损耗满足设计要求,可应用于实际的工程系统中。
【Abstract】 Aiming at the signal transmission problem in the phased array transceiver assembly in the millimeter-wave band, this paper designs two interconnection transition structures for the input and output ends, respectively. By designing and adjusting the structure and size of the model, the impedance matching relationship between the structures is adjusted so that the RF signals can realize low-loss transmission in the RF link. In this paper, the designed structures are modeled and simulated using three-dimensional electromagnetic simulation software, so that the return loss meets the design requirements in the millimeter-wave band of 30GHz-40GHz, and can be applied to actual engineering systems.
【Key words】 HTCC; millimeter wave; transceiver assembly; interconnection structure;
- 【会议录名称】 2024年全国微波毫米波会议论文汇编(上册)
- 【会议名称】2024年全国微波毫米波会议(中国微波年会)
- 【会议时间】2024-05-16
- 【会议地点】中国北京
- 【分类号】TN40
- 【主办单位】中国电子学会