【作者】 孙阳庭； 李劲； 蒋益明；

【Author】 SUN Yang-ting;LI Jin;JIANG Yi-ming;Department of Materials Science, Fudan University;

【机构】 复旦大学材料科学系；

【摘要】 随着电子产品向高性能化和高集成化方向发展,以焊点金属为代表的电子材料在制造工艺过程以及实际服役过程中会遇到复杂的、反常的腐蚀问题,极大地影响产品可靠性。本文首先从实际锡银焊料合金出发,研究Sn-Ag体系的腐蚀和枝晶生长过程,揭示了其中基本的热力学和动力学规律,确定了多种因素对选择性腐蚀行为的影响机制,包括工作电压、温湿度、pH值以及助焊剂等。随后通过特殊设计的SnAg合金进一步研究了Ag3Sn等金属间化合物在选择性腐蚀过程中的关键作用。在此基础上,建立了针对焊点腐蚀失效的评价方法和寿命预测模型,并应用到了更复杂的三元、四元多金属体系的选择性腐蚀研究中。更多还原

【Abstract】 As electronic products advance towards superior performance and higher integration, electronic materials, particularly solder metals, encounter complex and abnormal corrosion issues during manufacturing processes and actual service, significantly affecting product reliability. This paper begins with the study of the SnAg system, using practical Sn-Ag solder alloys to investigate the corrosion and dendrite growth processes. The fundamental thermodynamic and kinetic principles involved are revealed. The mechanisms by which various factors influence selective corrosion behavior are identified, including operating voltage, temperature and humidity, pH value, and flux. Subsequently, specially designed Sn-Ag alloys were employed to further examine the critical role of intermetallic compounds such as Ag3Sn in the selective corrosion process. Based on these findings, evaluation methods and a life prediction model for solder corrosion failure were established and applied to the study of selective corrosion in more complex ternary and quaternary multi-metal systems.更多还原