【作者】 杜帅； 王志刚；

【Author】 Shuai Du;Zhigang Wang;Fundamental Science on EHF Laboratory,University of Electronic Science and Technology of China;

【机构】 电子科技大学极高频复杂系统国防重点学科实验室；

【摘要】 高温共烧陶瓷(HTCC)技术因具有低成本、高导热、高集成度等特点,因此广泛应用于各个频段的T/R组件的设计。在实际应用中无源结构的射频性能将直接影响整个射频系统。在实际的设计生产时,封装结构要满足不同应用场景。本文针对HTCC的收发组件,在1-18GHz的频段内设计了基于球栅阵列的垂直互连结构,适用于较宽频带的SIP模块,具有很高的工程应用价值。更多还原

【Abstract】 High temperature co-fired ceramics(HTCC) technology With low cost,high thermal conductivity,high integration and other characteristics,Thus it is widely used in the design of T/R components in various frequency bands.In practical applications,the RF performance of passive structure will directly affect the whole RF system.In this paper,a vertical interconnection structure based on spherical grid array is designed for HTCC transceiver-receiving components in 1-18GHz frequency band.It is suitable for SIP modules with wide band and has high engineering application value.更多还原