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低浓度Cu-Ni-Si合金组织与性能的研究

Microstructure and properties of a low concentration of Cu-Ni-Si alloy

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【作者】 刘峰米绪军马吉苗黄国杰洪松柏解浩峰彭丽军

【Author】 LIU Feng;MI Xun-jun;MA Ji-miao;HUANG Guo-jie;HONG Song-bai;XIE Hao-feng;PENG Li-jun;State Key laboratory of Nonferrous Metals and process,General Research Institute for Nonferrous Metals;NingBo XingYe Sheng Tai Group Co.Ltd;

【机构】 北京有色金属研究总院有色金属材料制备加工国家重点实验室宁波兴业盛泰集团有限公司

【摘要】 本文采用金相显微镜、透射电子显微镜(TEM)等分析测试手段系统研究不同固溶、冷变形与时效组合工艺对低浓度Cu-Ni-Si合金的晶粒尺寸、析出相粒子尺寸及分布规律进行研究,同时对合金的力学与电学性能进行测试。结果表明,相对于其他四种工艺制度,低浓度Cu-Ni-Si合金经过立式在线固溶处理+冷变形+时效组合形变热处理工艺后,合金组织晶粒更加细小(平均晶粒尺寸为25μm),析出相分布更加弥散,抗拉强度为579MPa,屈服强度为521MPa,屈强比为0.9,伸长率为9%,导电率为52.2%IACS;与常用汽车连接器用C70250和TMg0.5合金综合性能进行对比,低浓度Cu-Ni-Si合金具有优良的综合性能,在大功率电流使用时表现出良好的散热性及可靠的尺寸稳定性,可作为高强高导弹性材料广泛应用于汽车连接器等领域。

【Abstract】 Effect of different theromechanical treatment on grain size,precipitate size and distribution of precipitation phase of low concentration of Cu-Ni-Si alloy were investigated by metallurgical microscopy,transmission electron microscopy.The mechanical properties and electrical conductivity of the alloy were also tested.The results show that the Cu-Ni-Si alloy had excellent properties(tensile strength was 579 MPa,yield strength was 521 MPa,yield-tensile ratio was 0.9,elongation was 9% and electrical conductivity was 52.2%IACS) and the average of grain size was 25 μm,when the alloy was solutioned treatment at vertical bright annealing furnace,cold rolled and aging treatment,which is relative to other four heat treatment processes.Compared with C70250 and TMg0.5 alloy,the low concentration of Cu-Ni-Si alloy had a good heat dissipation and reliable dimensional stability in1 the use processes of high power current,which can be widely used in the automotive connector field.

【基金】 国家重点研发计划项目(2016YFB0301300);国家自然科学基金资助项目(51601017)和(51561008)
  • 【会议录名称】 2021年中国铜加工产业年度大会暨中国(三门峡)铜产业高质量发展大会文集
  • 【会议名称】2021年中国铜加工产业年度大会暨中国(三门峡)铜产业高质量发展大会
  • 【会议时间】2021-06-09
  • 【会议地点】中国河南三门峡
  • 【分类号】TG146.11
  • 【主办单位】中国有色金属加工工业协会、河南省三门峡市人民政府、上海期货交易所
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