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高纯细晶Al2O3陶瓷金属化工艺研究
Research on Metallization Process for High-Purity and Fine-Gained Al2O3 Ceramics
【Author】 CHEN Li-mei;HUANG Yi-gong;ZHANG Ju-xian;Beijing Vacuum Electronics Research Institute;Vacuum Electronics National Laborarory;
【机构】 北京真空电子技术研究所; 大功率微波电真空器件技术国防科技重点实验室;
【摘要】 本文主要从金属化配方、涂膏方法、金属化层的厚度、金属化温度和镍层的厚度等工艺角度对高纯、细晶Al2O3陶瓷的封接性能进行研究和分析。其结果显示,采用高Mo含量的金属化膏剂、丝网印刷的涂膏方法、金属化层的厚度约为20μm、在1450℃下烧结,镍层的厚度5μm左右时,其平均抗拉强度可达143MPa,超出行业标准50%以上,其显微结构更加连贯、均匀、致密。
【Abstract】 In this paper,by changing metallization formula,coating technique,thickness of metalling layer,sintering temperature,and the nickel thickness,the effects of metallization process on the ceramicmetal sealing property of high-purity and fine-grained Al2O3 ceramics are analyzed.The resultsindicate thatusing high Mo content as formula,using screen printing coating technique,setting metallizedthickness to be about 20μm,sinteringat 1450℃,and setting nickel thickness to be about 5μm,the average tensilestrength of the standard Al2O3 is up to 143 MPa,which is 50%higher than the industry standard values.The microstructure of the metallized coating is more coherent,uniform,and compact.
【Key words】 High-purity and fine-grained Al2O3 ceramics; Sealing strength; Microstructure; Metallized layer;
- 【会议录名称】 真空电子技术—电子陶瓷、陶瓷-金属封接专辑
- 【会议时间】2014-11-01
- 【分类号】TN104.2