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SiC-AlN复相陶瓷材料的无压烧结和导热性能
Study of Pressureless Sintering and Thermal Conductivity for SiC-AlN Composites
【作者】 张景贤; 江东亮; 姚秀敏; 陈忠明; 刘学建; 黄政仁; 杨建; 李晓云; 丘泰;
【Author】 ZHANG Jing-xian;JIANG Dong-liang;YAO Xiu-min;CHEN Zhong-ming;LIU Xue-jian;HUANG Zheng-ren;YANG Jian;LI Xiao-yun;QIU Tai;High Performance Ceramics and Superfine Structure of National Key Laboratory,Shanghai Institute of Ceramics,Chinese Academy of Sciences;College of Materials Science and Engineering,Nanjing Tech University;
【机构】 中国科学院上海硅酸盐研究所高性能陶瓷和超微结构国家重点实验室; 南京工业大学材料科学与工程学院;
【摘要】 采用无压烧结工艺制备了SiC-AlN复相陶瓷材料,采用X射线衍射(XRD)、扫描电镜和激光导热仪对材料的晶相、微结构和导热性能进行了综合研究。实验发现,烧结体的密度和AlN的添加量有关。在AlN添加量低于10%(质量比)时,烧结体的相对密度随着AlN含量的升高而升高。在添加量高于10%时,AlN的添加对于烧结不利。复相陶瓷的热导率随着AlN含量的增加而下降。这和材料内部固溶体的形成有关。XRD测试发现,随着AlN含量的升高,2H固溶相增加。这直接影响到材料的烧结性能和热导率。
【Abstract】 SiC-AlN composites were prepared by pressureless sintering.The phase,microstructure and the thermal conductivity was investigated based on XRD,SEM and laser thermal conductivity measurements.It was found that the addition of AlN had obvious influence on the densification of SiC.The density of SiC-AlN composites increased with the increase ofAlN content up to 10%(wt)and decrease thereafter.The thermal conductivity of SiC-AlN decreased with the increase of AlN content.This can be related to the formation of solid solution of 2Hphase.The more the AlN content,the more the 2Hphase formed.The presence of 2Hphase has obvious influence on the sintering and the thermal conductivity of SiC-AlN composites.
【Key words】 Silicon carbide; Aluminum nitride; Pressureless sintering; Thermal conductivity;
- 【会议录名称】 真空电子技术—电子陶瓷、陶瓷-金属封接专辑
- 【会议时间】2014-11-01
- 【分类号】TN104.2