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低银无铅钎料及电子封装微焊点的可靠性

Studies on the heterogeneous precipitation in an Al-Cu-Mg alloy

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【作者】 孙凤莲

【Author】 Yanqing Yang,Zongqiang Feng,Maohua Li,Yanxia Chen,Bin Huang (State Key Lab of solidification Processing.Northwestern Polytechnical University,Xi’an.P.R.China)

【机构】 哈尔滨理工大学 精密焊接及微连接实验室

【摘要】 介绍低银无铅钎料的研究现状及存在的问题;本研究团队的主要研究工作进展;通过与SAC305比较,介绍一种新型低银无铅钎料SACNiBi的可焊性、抗热疲劳、机械疲劳及抗电迁移性能。

【Abstract】 The properties of an age-hardening aluminum alloy can be affected greatly by the heterogeneous precipitation.The microstructures of the heterogeneous precipitation in an Al-Cu-Mg alloy after artificial ageing were investigated.Two kinds of S phase formed along dislocation were observed by HRTEM and the precipitation sequence,variant selection and the strengthening effect of the S precipitates were discussed. The three-dimentional morphology of the S phase formed along dislocation lines,on grain boundary were characterized by using the technique of STEM-HAADF 3D tomography.Quantitative parameters describing the shape and the distribution of the grain boundary precipitates(GBP) were calculated based on the 3D tomography analysis.

  • 【会议录名称】 第八届全国材料科学与图像科技学术会议论文集
  • 【会议名称】第八届全国材料科学与图像科技学术会议暨中国体视学学会材料科学分会2012年学术年会
  • 【会议时间】2012-10-18
  • 【会议地点】中国山东荣成
  • 【分类号】TG454
  • 【主办单位】中国体视学学会材料科学分会
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