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非晶态Ni-Cu-P合金镀层结构及性能研究
study on structure and properties of amorphous Ni-Cu-P alloy coatings
【Author】 XU Ruidong,WANG Junli,XUE Fangqin,GUO Zhongcheng (Faculty of Materials and Metallurgical Engineering,Kunming University of Science and Technology,Kunming 650093,China)
【机构】 昆明理工大学材料与冶金工程学院;
【摘要】 研究了化学镀Ni-Co-P复合镀层成分,结构及硬度等性能。结果表明,镀层镍含量随镀液中硫酸铜浓度的增加而降低,而铜、磷含量随硫酸铜浓度的增加而提高。由于铜优先析出的特征,镀层中Cu/Ni质量比远高于镀液中Cu/Ni质量比;镀态下Ni-Co-P合金层结构为含铜、磷原子的镍基饱合固溶体;Ni-7.929%Cu-8.227%P合金镀层在镀态及300℃以下热处理时,为非晶态结构,镀层硬度没有明显变化。400℃热处理时,有热力学平衡相Ni3P和Cu3P析出,镀层已转为晶态结构,硬度达到最高值。此后,镀层硬度又开始降低。
【Abstract】 Some properties such as components,structure and hardness of Ni-Cu-P composite coatings,were studied.The results show that the nickel content in coating decreases and Cu,P contents increase with increasing CuSO4 ?5H2O concentration in bath;Owning to the characteristic of priority of Cu deposition,it makes Cu/Ni ratio in coating is obviously higher than that in bath;the structure of Ni-Cu-P alloy coating is oversaturated solid solution with respect to nickel and phosphorus as-deposited;Ni-7.929%Cu-8.227%P alloy coating is amorphous state and the hardness of the composite coating is not changed obviously as-deposited and below 300℃heat treatment temperature; but heated at 400℃for 1hour,there are thermodynamics equilibrium phase deposited such as Ni3P and Cu3P,so that the hardness of the coating increases rapidly and reaches the peak value;After that,the hardness begins to decrease with the rise of heat treatment temperature.
- 【会议录名称】 2004年全国电子电镀学术研讨会论文集
- 【会议名称】2004年全国电子电镀学术研讨会
- 【会议时间】2004-12-05
- 【会议地点】中国重庆
- 【分类号】TQ153.2
- 【主办单位】中国电子学会生产技术学分会、重庆表面工程技术学会