【作者】 张华； 陈安定； 於晓峰； 丁玉宁； 王子良； 戴雷；

【Author】 ZHANG hua~(1,2),Chen anding~1,Yu xiaofeng~1,Ding yuning~1,Wang ziliang~(1,2),Dai lei~1 (1 Nanjing Electronic Devices Institute,Nanjing 210016; 2 National Key Laboratory of Monolithic Integrated Circuits and Modules,Nanjing 210016)

【机构】 南京电子器件研究所； 单片集成电路与模块国家重点实验室；

【摘要】 本文设计了基于LTCC基板的三维多层微波延迟线,用于SIP系统。采用同轴线的概念,设计了类同轴垂直转换结构,以提供多层传输线间的连接。设计了多层弯折延迟线,对延迟线进行了三维全波电磁仿真优化,获得了较好的信号完整性:并在4～8GHz频率内,分别获得了0.2nS和0.55nS的延迟时间。更多还原

【Abstract】 In this paper,the three-dimensional(3D) multilayer microwave delay lines LTCC-based are designed,for system in package(SIP) applications.We proposed an advanced signal via structure with quasi coaxial ground vias,which adopt the concept of coaxial line.It is provided to signal propagation in multilayer transmission lines.The multilayer strip meander delay lines using LTCC substrate were designed and fabricated.We will show the simulated results using 3D full-wave EM in frequency domain and testing results.Using the 3D strip meander lines with the advanced via structure,good signal integrity can be achieved at high frequency.Both delay lines are designed for total 0.2nS and 0.55nS time delay in 4-8GHz frequency range.更多还原