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超细铜粉表面包覆有机物进行改性的工艺及性能研究

The Study on the Process of Modified the Surface of Ultra-fine Powder with Organism

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【作者】 谭宁郭忠诚陈步明

【Author】 Tan Ning,Guo Zhongcheng,Chen Buming,Huang hui (Faculty of Materials and Metallurgical Engineering,Kunming University of Science and Technology,Kunming 650093,China)

【机构】 昆明理工大学材料与冶金工程学院

【摘要】 超细铜粉的应用领域广泛,但由于其表面活性较高,易氧化,导致失去金属光泽,导电性变差,从而限制了其在很多领域的应用。故采取有效措施解决超细铜粉易氧化的问题成为人们普遍关心的话题。本文采用在铜粉表面包覆一层有机物来提高其抗氧化能力,经实验发现改性后的铜粉常温及高温抗氧化能力均较好,且导电性能也较好,且工艺操作简单,可实现工业应用。

【Abstract】 Ultra - fine copper powder can be used in many fields,but because the activity of the copper powder surface was high,so it can be oxidized easily,lead to the metallic color losing,conductivity becoming bad,and limiting the application of ultra - fine copper powder in many areas.Thus some measures should be adopted to solve the problem.In this paper using some organism covered on the surface of the copper powders to improve the antioxidant ability of the powders.Through the experiment found that the antioxidant ability of modified copper powders were good at normal and high temperatures,and the conductivity were better,and the operation of this process was easy and was able to realize the application in industry.

  • 【会议录名称】 2009年全国电子电镀及表面处理学术交流会论文集
  • 【会议名称】2009年全国电子电镀及表面处理学术交流会
  • 【会议时间】2009-11-01
  • 【会议地点】中国上海
  • 【分类号】TG174.4
  • 【主办单位】中国电子学会生产技术学分会电镀专家委员会、上海市电子学会电子电镀专业委员会
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