【作者】 张美娟； 陈亮； 亚斌； 贾非； 张兴国；

【Author】 ZHANG Mei-juan,CHEN Liang,YA Bin,JIA Fei,ZHANG Xing-guo (School of Materials Science and Engineering,Dalian University of Technology,Dalian 116024,China)

【机构】 大连理工大学材料科学与工程学院；

【摘要】 研究了镁和碲元素含量对导电铜合金的显微组织、力学性能及导电率的影响。向铜中加入镁和碲元素进行合金的熔炼,并对其进行显微组织、抗拉强度和延伸率,以及导电性等性能的测试分析。结果表明,在铜中加入少量的镁元素和碲元素,与纯铜相比具有较高的抗拉强度和延伸率,但是镁含量偏高时合金的导电率显著下降,因此,应控制合金中镁含量处于较低值。更多还原

【Abstract】 This research is relative to the copper alloy with elements of Mg and Te which may affect the tensile strength and electric conductivity.In this research,Mg and Te was added into the copper to smelt,and the microstructure, tensile strength,elongation and conductivity of the copper alloy was tested and analyzed.The results showed that the alloy with elements of trace Mg and Te has advantages of high tensile strength and good elongation, but the electrical conductivity of Cu-Mg-Te alloy with high content of Mg will markedly decrease.So it is better to control the content of Mg with a low value.更多还原