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脉冲缓冲层对AlN外延层位错密度的影响
Effect of Pluse Buffer Layer on AlN Epilayer Dislocation Density
【作者】 桑立雯; 秦志新; 方浩; 代涛; 杨志坚; 沈波; 张国义; 张小平; 俞大鹏;
【Author】 Sang Liwen~a,Qin Zhixin~a,Fang Hao~a,Dai Tao~a,Yang Zhijian~a, Shen Bo~a,Zhang Guoyi~a,Zhang Xiaoping~b,Yu Dapeng~b (a.Research Center for Wide gap Semiconductor,State Key Laboratory for Laboratory of Artificial Microstructure and Mesoscopic Physics;b.Electron Microscope Laboratory, Peking University,Beijing 100871,China)
【机构】 北京大学介观物理和人工微结构国家重点实验室宽禁带半导体研究中心; 北京大学电镜室;
【摘要】 在蓝宝石衬底上采用交替通Al源和NH3的方法生长的100周期的AlN作为缓冲层,随后外延生长AlN薄膜。X射线衍射结果表明AlN外延层中的位错密度大大降低。通过透射电镜观察位错在样品中的形貌,发现在缓冲层和外延层之间存在明显的界面。界面之上的位错通过形成位错环互相湮灭或者直接终断于界面,使得在外延层中大量减少。研究表明,位错环的形成是由于在外延层的生长过程中侧向生长速率增加导致位错在镜像力的作用下互相吸引造成的。而位错在界面处的终断则被认为是由于界面上下应变发生变化引起的。
【Abstract】 The AlN epilayer was grown on sapphire substrate with the introduction of a pulsed atomic-layer epiraxial(PALE) AlN buffer layer.Threading dislocations(TDs) densities in AlN epilayer were shown to be greatly decreased.From transmission electron microscopic images,a clear subinterface was observed between the buffer layer the subsequently continuous grown AlN epilayer.In the vicinity of the subinterface,the redirection,annihilation,and termination of TDs were observed.It is found that the redirection and annihilation of TDs are attributed to the increase in lateral growth rate.The strain variation between the two regions results in the termination of TDs owing to the dislocation line energy minimization.
【Key words】 compound semiconductor material; dislocations; TEM; sapphire; AlN;
- 【会议录名称】 第十五届全国化合物半导体材料,微波器件和光电器件学术会议论文集
- 【会议名称】第十五届全国化合物半导体材料,微波器件和光电器件学术会议
- 【会议时间】2008-11-30
- 【会议地点】中国广东广州
- 【分类号】TN304.23
- 【主办单位】中国电子学会半导体与集成技术分会、电子材料分会