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AlN陶瓷与无氧铜的活性封接
Active Brazing of AlN and Oxygen-Free Copper
【Author】 LIU Xin,ZHANG Xiao-yong,LU Yan-jie,FANG Zhen-zheng,CHU Jian-xin (Beijing General Research Institute for Nonferrous Metals,Beijing 100088,China)
【机构】 北京有色金属研究总院;
【摘要】 采用Ag-Cu-Ti活性钎料对AlN陶瓷与无氧铜进行了钎焊。通过对焊接件气密性的测试、陶瓷/金属结合界面的微观分析以及界面化学反应的热力学计算,得出以下结论:Ag-Cu-Ti2.0钎料可以实现AlN与无氧铜的气密封接,漏气速率Q<10×10-8Pa.L/s;钎料与陶瓷界面存在一定厚度的化学反应区,反应产物主要是TiN。
【Abstract】 AlN ceramic and oxygen-free copper had been brazed using Ag-Cu-Ti active alloy.We tested the airtight capability of the brazing sample,analyzed the microstructures at the brazing interface,and calculated the thermodynamics factors on the brazing chemic reaction.The results indicated that Ag-Cu-Ti2.0 brazing filler metal can join AlN with oxygen-free copper directly,its rate of air leakage Q<10×10-8 Pa·L/s,and there was a chemic reaction area which had an appropriate thickness,and the final reaction productions were mostly TiN.
- 【会议录名称】 陶瓷——金属封接与真空开关管用管壳技术进步专辑
- 【会议时间】2007-08
- 【分类号】TG454