【作者】 丁俊民； 孙玲； 刘炎华；

【Author】 DING Junmin SUN Ling LIU Yanhua Nantong University,Nantong 226007,China

【机构】 南通大学；

【摘要】 基于北京新润泰思特测控技术有限公司的BC3196D数模混合集成电路测试系统,提出了一种音频功率放大器的封装测试方案。从分析该功率放大电路所要求的测试指标开始,介绍了测试电路板的设计方法;从分析该数模混合集成电路测试系统的特点入手,介绍了测试程序开发流程,并结合静态工作电流、输出功率、总谐波失真以及电源抑制比等具体指标,给出了采用计算机高级语言Visual C++编写与调试测试程序的实例。更多还原

【Abstract】 Based on the mixed-signal IC test system provided by Beijing Xinrun Test &Control Technology Co.Ltd,the scheme for package test of an audio power amplifier was advanced,At the beginning,test items of this circuit were analyzed and the design of test board was introduced.Then,by learning the features of this mixed-signal IC test system,the test flow was developed,and according to the specific item, such as quiescent current,output power,total harmonic distortion and power supply rejection ratio,test programs written in senior computer language Visual C++ were presented.更多还原