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材料表面下缺陷的红外热波成像检测
Infrared Thermal Wave Imaging for Detection and Measurement of the Subsurface Defects of Materials
【作者】 梅辉; 成来飞; 邓晓东; 孙磊; 张立同; 徐永东; 赵东林;
【Author】 MEI Hui,CHENG Laifei,DENG Xiaodong,SUN Lei,ZHANG Litong, XU Yongdong,ZHAO Donglin (National Key Laboratory of Thermostructure Composite Materials, Northwestern Polytechnical University.Xi’an 710072)
【机构】 西北工业大学超高温结构复合材料国防科技重点实验室;
【摘要】 在高纯石墨板上钻不同直径和深度的盲孔作为标样,模拟材料表面下的孔洞缺陷。利用红外热成像技术对标样材质热辐射值的敏感性,检测标样内部的缺陷信息,测量缺陷尺寸和位置。结果表明:红外热成像技术可以测出缺陷的形状、大小和深度。直径相同的盲孔,深度越深,其热辐射强度越低,热辐射能量与深度成反比;深度相同的盲孔,直径越大,热辐射强度越高,热辐射能量与面积成正比。缺陷直径增加,测量误差减小;缺陷深度增加,测量误差增加。
【Abstract】 High-purity graphite calibration specimen drilled with the blind holes of various diameters and various depths were prepared in order to simulate defects of air voids or delaminations under the surface of materials.Thermographic technique,due to its high sensitivity to thermal radiation ability of different materials,was utilized to detect sizes and locations of the defects in the specimens.The results indicate that thermographic technique is able to detect the geometries,dimensions and depths of the defects in the specimens.For the blind holes with the same diameter,intensity of thermal radiation decreases as the depths of holes increase,i.e.,thermal radiation energy is inversely proportional to the depth of the blind holes;for the blind holes with the same depth,intensity of thermal radiation increases as diameters of holes increase,i.e.,thermal radiation energy is directly proportional to the area of the blind holes.Measurement error reduces when the defect diameters increase,and increase when the defect depths increase.
【Key words】 Defect calibration specimen; Nondestructive testing; Thermographic technique Defect measurement;
- 【会议录名称】 第十五届全国复合材料学术会议论文集(下册)
- 【会议名称】第十五届全国复合材料学术会议
- 【会议时间】2008-07-24
- 【会议地点】中国黑龙江哈尔滨
- 【分类号】TB303
- 【主办单位】中国力学学会