【作者】 郑知敏； 胡继东； 赵彤； 徐彩虹； 张志杰； 谢择民；

【Author】 Zheng Zhimin,Hu Jidong,Zhao Tong,Xu Caihong,Zhang Zhijie,Xie Zemin (Institute of Chemistry,the Chinese Academy of Sciences,Beijing 100080)

【机构】 北京分子科学国家实验室分子科学中心高技术材料实验室,中国科学院化学研究所；

【摘要】 采用二苯基二羟基硅烷与含乙烯基聚硅氮烷（SiN08）反应合成了三种含二苯基硅氧链节的聚硅氧硅氮烷MPSZ（代号分别为:MPSZ-1,MPSZ-2,MPSZ-3）,用以改性烯丙基酚醛树脂（AP）。与纯烯丙基酚醛树脂相比,聚硅氧硅氮烷/烯丙基酚醛杂化树脂体系的热分解温度和高温残重都有较大提高。纯烯丙基树脂在N₂气氛中5%失重温度为383℃, 900℃残重为33.0%;MPSZ-1/AP的5%失重温度为465℃,900℃残重为74.4%。在空气气氛中,纯烯丙基树脂900℃残重仅为1.5%,MPSZ-1/AP的900℃残重为33.8%。MPSZ -1/AP体系的热分解温度和高温残重与SiN08/AP体系相当,而其固化失重较低,仅为4. 4%,适用于RTM成型工艺制备复合材料。对聚硅氮烷/AP体系的固化过程进行了初步的研究,Si—N键在固化过程中起主要作用。更多还原

【Abstract】 Three kinds of polysiloxazanes（MPSZ） containing diphenylsiloxane units were synthesized by reaction between diphenyldihydroxyl silane and polysiloxane containing vinyl groups,for modification of allyl phenolic（AP） resin.Compared with pure AP resin,the thermal decomposition temperature and residue weight at 900℃of hybrid polysiloxazane/allyl phenolic resins greatly increased. Under N₂ atomosphere,the temperature at 5%weight loss of pure AP resin was 383℃,and residue weight at 900℃33.0%.while that of MPSZ-1/AP was 465℃and 74.4%.respectively.The thermal decomposition temperature and residue weight at 900℃of MPSZ-1/AP were similar to that of SiN08/AP,but with less weight loss of 4.4%during curing,which is advantageous for fabrication of composites using Resin Transfer Molding（RTM） process.Curing of polysilazane/AP was investigated by DSC,which showed that Si-N bond played key roles in crosslinking.更多还原