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溅射工艺及底层对SmCo薄膜磁性能的影响

Effect of sputtering parameters and underlayer on magnetic properties of SmCo thin films

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【作者】 张峰黄致新王辉吴斌杨晓非程伟明

【Author】 ZHANG Feng~1 HUANG Zhi-xin~1 WANG Hui~1 WU Bin~1 YANG Xiao-fei~2 CHENG Wei-ming~2 (1.College of Physical Science andTechnology,Huazhong Normal University,Wuhan 430079,China; 2.Department of Electronic Science & Technology,Huazhong University of Science &Technology,Wuhan 430074,China)

【机构】 华中师范大学物理科学与技术学院华中科技大学电子科学与技术系

【摘要】 用多靶射频磁控溅射系统在玻璃基片上制备了 SmCo 磁性薄膜.并采用控制变量法研究了溅射功率、溅射时间以及溅射气压等工艺参数对薄膜磁性能的影响.结果发现,当磁性层溅射功率为60W,溅射气压为 0.5Pa,溅射时间为8min:底层溅射功率为125W,溅射气压为0.5Pa,溅射时间为4min 时,薄膜的矫顽力高达2.79×10~5.底层对 SmCo 薄膜的磁性能也有影响, 振动样品磁强计测量结果表明:相比 Cr、Ti 底层,以 Cu 作为底层所得到的 SmCo 薄膜磁性能更好,薄膜矫顽力分别比用 Cr、Ti 作底层时高出56%,40%.

【Abstract】 SmCo magnetic thin films were prepared onto glass substrates by RF magnetron sputtering system.The effect of sputtering power,sputtering time and sputtering pressure on the magnetic properties of the thin films were investigated by the parameter control method.It is found that when the sputtering power,sputtering pressure and sputtering time of the SmCo thin films and the underlayer are 60W,0.5Pa and 8min,125W,0.5Pa and 4min,respectively,the coercivity that in the plane direction is as high as 2.79×10~5 Underlayer also has effect on the properties of SmCo thin films.The VSM measurements revealed that SmCo thin films will possess better magnetic properties with Cu as underlayer than Ti and Cr.Compared with Cr and Ti as underlayer,the coercivity of SmCo thin films with Cu underlayer is higher 56% and 40%,respectively.

【基金】 湖北省自然科学基金(2005ABA041);国家自然科学基金(60571010)
  • 【会议录名称】 第六届中国功能材料及其应用学术会议论文集(3)
  • 【会议名称】第六届中国功能材料及其应用学术会议
  • 【会议时间】2007-11
  • 【会议地点】中国湖北武汉
  • 【分类号】TB43;O484.43
  • 【主办单位】重庆仪器材料研究所、中国仪器仪表学会仪表材料分会、国家仪表功能材料工程技术研究中心
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