【作者】 胡骏；

【Author】 Hu Jun China Electronic Technology Corporation No.38 Institute Anhui Hefei 230031

【机构】 中国电子科技集团第三十八研究所；

【摘要】 三维多芯片组装技术是实现电子整机系统集成的有效途径。本文提出一种三维多芯片组装的设计思路及实现方法,提高了芯片安装效率及组装密度,测试结果与设计相符。更多还原

【Abstract】 The 3D multi-chip assembly is the efficiency approach to realize the system integration for electronic equipment.A design and a realization of 3D multi-chip assembly have been proposed in this paper. This method improves the mount efficiency and the assembly density of the chip.The result goes with the design very well.更多还原