【作者】 刘和平； 袁庆龙； 侯文义；

【Author】 LIU Heping~1 YUAN Qinglong~2 HOU Wenyi~2 (1 College of Materials Science and Engineering,Taiyuan University of Technology,Taiyuan 030024;2 College of Mechanical Engineering,Taiyuan University of Technology,Taiyuan 030024)

【机构】 太原理工大学材料科学与工程学院； 太原理工大学机械工程学院；

【摘要】 在磁控条件下对 H62/Cu 同基合金进行了电弧离子镀试验。采用 SEM、EDS、XRD、显微硬度计、声发划痕仪等测试手段对镀层进行了分析。结果表明,在加磁的条件下施镀的镀层与靶材存在成分差异。镀层中存在与靶材相同的多种铜锌化合物相。弧电流较高时镀层的显微硬度较大。镀层沉积得非常致密,与基体结合强度良好,划痕试验曲线未出现声发射信号峰。更多还原

【Abstract】 Arc ion plating test of H62 on the Cu substrate is carried out under the condition of magnetron, which has same basic component for both the deposited layer and the substrate.The deposited layer on the Cu substrate is analyzed with SEM,EDS,XRD and the acoustic emission scratching methods.The results show that there is a com- position difference between the deposited layer and the target,but there are same Cu-Zn chemical compounds in the two ones.The higher the arc current is,the greater the hardness of the deposited layer is.The deposited layer is fine and close in structure and the cohesion between the deposited layer and the substrate is high since no signal peak occurs in the acoustic emission scratching test.更多还原