【作者】 陈明祥； 易新建； 甘志银； 刘胜；

【Author】 Chen Mingxiang Yi Xinjian Gan Zhiyin Liu ShengHuazhong University of Science & Technology ,Wuhan, 430074Wayne State University, Detroit, Michigan,48202,USA

【机构】 华中科技大学；

【摘要】 对感应局部加热实现MEMS封装键合进行了初步研究。试验中选用功率为1kW、频率为400kHz的高频电源,通过对感应线圈优化设计,实现了硅片上的焊料图形键合。为实现局部加热,感应加热图形(键合区)应设计为封闭环结构(同时也易于形成气密封装结构),而芯片上其他部分(包括电路、连线、焊点等),由于为非封闭结构和图形,无涡流产生或产生的涡流很小,仍处于较低温度,从而避免了高温对芯片上温度敏感结构的破坏。此外,还对影响键合效果的感应层材料和结构设计进行了探讨。更多还原

【Abstract】 By choosing suitable frequency of high frequency power supply and optimizing the induction coil, local induction heating for MEMS bonding has been investigated. Induction heating patterns (bonding area) should be closed loop (also for hermetic packaging), while other patterns (such as circuit, pad, et al. ) cannot be heated because of unclosed structures, because no eddy current or little eddy current was inducted and kept at low temperature, so damages on some temperature-sensitive devices were avoided. Moreover, some effects of induction materials, coil design on induction heating were discussed.更多还原