【作者】 史庆南； 王军丽； 王效琪； 郑巍黎； 陈明昕；

【Author】 Shi Qingnan Wang Junli Wang Xiaoqi Zheng Weili Chen Mingxin ( Kunming University of Science & Technology, Kunming, 650093 )

【机构】 昆明理工大学材料与冶金工程学院；

【摘要】 本文主要对不同条件下叠轧并退火处理的无氧铜试样进行显微硬度、拉伸率测试及计算,以及扫描被散射电子衍射(EBSD)、金相显微分析。真应变和显微硬度及拉伸率关系表明叠轧后样品的强度、塑性都得到提高;从金相显微组织照片看出叠轧后晶粒尺寸变小,而且叠轧道次越多,细化程度越明显;EBSD晶粒图、晶界分布图分析表明低道次叠轧后材料局部出现细小晶粒和小区域小角度晶界。各种分析结果表明叠轧可以达到细化晶粒的效果,该方法制备超细晶材料具有可行性。更多还原

【Abstract】 The oxygen-free copper samples after ARB and annealing at different conditions are analyzed by means of the testing and calculation of hardness and tension rate, and the analysis of optical microscopy and electron backscatter diffraction ( SEM). The relations of the hardness, tension rate and true strain show that the intension and plasticity of the samples after ARB have been enhanced; It is also obtained that the grain size has been become small through optical microscopy, and more times of ARB, more small grain size; the grain mapping and crystal boundary distribution mapping of EBSD show that small grains and small angle crystal boundaries appear at some areas. It shows that it is accessible to prepare extra-fine grained material with ARB.更多还原