【作者】 崔玉建； 葛洪良； 黄丽红； 周红； 韩雁冰； 刘亚丕；

【Author】 Cui Yujian, Ge Hongliang, Huang Lihong, Zhou Hong, Han Yanbing, Liu Yapi ( Physics Department, China Institute of Metrology, Hangzhou 310018, China)

【机构】 中国计量学院应用物理系；

【摘要】 报道了以钨酸钠、硫酸钴和二亚硝酸二胺铂为主盐、以柠檬酸盐为络合剂电沉积钴铂钨合金的工艺过程。研究了镀液中钨盐浓度、络合剂浓度、电流密度、镀液温度等沉积条件对钴铂钨合金成份的影响。结果表明,在实验条件下,镀液中钨盐含量的增加、电流密度的增大和镀液温度的升高都会引起合金镀层中的钨含量增大。络合剂用量的增加使合金镀层中的钨含量下降,而使钴和铂的含量增加。更多还原

【Abstract】 A series of cobalt-platinum-tungsten alloys were deposited with sodium tungstate and cobaltous sulfate as the main salts and citrate as the complex agent. The effects of tungsten salt, complex agent, sodium ion, current density and temperature on alloy composition were studied. The results show that thetungsten content in cobalt-platinum-tungsten alloy increases with increasing concentration of tungsten salt, current density and temperature, and decreases with increasing complexing agent and cobalt, and platinum content decreases with increasing complexing agent.更多还原