【作者】 黄福祥； 张津； 杜长华； 吴光凤；

【Author】 HUANG Fuxiang ZHANG Jin DU Changhua WU Guangfeng(Department of Materials Science and Engineering Chongqing Institute of Technology,Chongqing 400050)

【机构】 重庆工学院材料学与工程学院；

【摘要】 引线框架材料是半导体元器件和集成电路封装的主要材料之一,其主要功能为电路连接、散热、机械支撑等作用。随着IC向高密度、小型化、低成本方向的发展.对引线框架材料提出了高强度、高导电、高导热等多方面性能上的要求。由于拥有良好的导热性能,铜合金已成为主要的引线框架材料。对电子封装引线框架材料的性能要求、设计理论以及国内外研究发展现状等进行了综述。更多还原

【Abstract】 Lead frames are one of the most important component parts of discrete and IC devices, wich provide electrical interconnection to the board,heat dissipation for the IC devices and mechanical support for the device and the package. With the development of IC to high density, miniaturization、low cost,the count of I/O increased,lead pitch decreased,which demand high strength、high conductivity for lead frame meterials. Because of their good electrical and conductivity and cost,copper alloys for lead frames are widely used in IC packages. In this paper,the requirement,research and development are summarized with respect to lead frame meterials.更多还原