【作者】 刘伟；

【导师】 冯哲圣；

【作者基本信息】 电子科技大学 ， 材料科学与工程， 2024， 硕士

【摘要】 随着消费电子的快速发展,人们对介质基板的类型与应用范围提出了更高的要求。针对于不同的材料与结构特性,介质基板可按照弹性模量分为刚性基板和挠性基板,主要用于印制电路板、封装用转接板以及柔性电子等不同的应用领域。目前,由于极佳的绝缘性与低廉的价格,玻璃基板的金属化被认为是电子封装和电子线路基板中不可或缺的发展方向。此外,柔性电子所使用的有机物材料表面金属化同样成为了业内急于解决的技术难题。为此,本研究提出了针对刚性玻璃基板和挠性聚对苯二甲酸乙二醇酯(Polyethylene Glycol Terephthalate,PET)基板的金属化技术方案,采用分步处理,实现了刚/挠性基板表面的高质量金属沉积。本研究具体的内容与结论如下:(1)研究了针对PET基板的表面改性方案。针对PET表面制定了硫酸/铬酸表面粗糙度调整技术,对粗糙度、亲水性与表面能等进行调控,并采用邻苯二酚与四乙烯五胺为表面引入了额外的氨基与亚氨基。经过改性后的PET具备了吸附银离子的能力,附着在其上的银离子充当化学镀铜过程中的活化位点,实现PET表面高附着铜层的制备。(2)研究了针对玻璃基板的表面预处理方案。针对玻璃基板难以刻蚀且性质稳定的特点,采用溶胶-凝胶法制备适用于玻璃表面的二氧化钛溶胶,并通过提拉法在玻璃表面成功制备液态膜,随后的多步高温烧结成功为玻璃表面引入均匀的二氧化钛啮合层。通过对比多步处理带来的银离子吸附效果最终确定了玻璃的表面调整方案,并比较了银离子浓度对铜层带来的影响。通过一系列对比实验,确定了6次提拉循环与15 min的化学镀铜时间,最终得到2.92μ?·cm电阻率的铜层,铜层厚度约500 nm,附着力达到5.68 N/mm~2。(3)对金属化后的PET基板和玻璃基板进行了一系列的可应用性测试。两种基板的金属层均通过百格测试,且在高强度的耐腐蚀性测试与压缩/拉伸测试中表现出优异的稳定性。各项测试结果证明了本研究所用方法具有实际可行性,有望成为新一代消费电子中的新型基板。更多还原

【Abstract】 With the rapid development of consumer electronics,higher demands for the types and application ranges of dielectric substrates are being raised.Dielectric substrates,characterized by their material and structural properties,can be categorized into rigid and flexible substrates based on their modulus of elasticity.These substrates are predominantly utilized in various application fields,such as printed circuit boards(PCBs),interposers for packaging,and flexible electronics.At present,the metallization of glass substrates is considered an indispensable direction for the development of electronic packaging and circuit board substrates,due to their excellent insulating properties and low cost.Additionally,the metallization of organic materials used in flexible electronics also poses a technical challenge that the industry is eager to address.This study proposes metallization techniques for rigid glass substrates and flexible Polyethylene Glycol Terephthalate(PET)substrates,employing step-by-step processing to achieve highquality metal deposition on both types of substrates.The specific contents and conclusions of this study are as follows:(1)Surface modification schemes for PET substrates were investigated.Roughness adjustment techniques using sulfuric acid/chromic acid were developed for PET surfaces to control roughness,hydrophilicity,surface energy,etc.Additionally,catechol and tetraethylenepentamine were introduced to the surface to provide additional amino and imino groups.The modified PET exhibited the ability to adsorb silver ions,with the adsorbed silver ions acting as activation sites during the chemical copper plating process,resulting in a high-adhesion copper layer on the PET surface.(2)Surface pretreatment schemes for glass substrates were studied.Considering the difficulty of etching glass substrates and their stable properties,titanium dioxide sol was prepared using the sol-gel method suitable for glass surfaces.A liquid film was successfully prepared on the glass surface using the pull-off method,followed by multistep high-temperature sintering to introduce a uniform titanium dioxide interlocking layer on the glass surface.By comparing the silver ion adsorption effects of multi-step treatments,the surface adjustment scheme for glass was determined,along with an assessment of the influence of silver ion concentration on the copper layer.Through a series of comparative experiments,it was determined that 6 cycles of pull-off and 15 minutes of chemical copper plating resulted in a copper layer with a resistivity of 2.92μ?·cm,a thickness of about 500 nm,and an adhesion strength of 5.68 N/mm2.(3)A series of applicability tests were conducted on the metallized PET and glass substrates.The metal layers on both substrates passed the grid test and exhibited excellent stability in high-intensity corrosion resistance tests and compression/tensile tests.The results of various tests have confirmed the practical feasibility of the methods employed in this study,holding the promise for these to become a new type of substrate in the next generation of consumer electronics.更多还原