【作者】 李智；

【导师】 金洙吉；

【作者基本信息】 大连理工大学 ， 机械工程（专业学位）， 2013， 硕士

【摘要】 电化学沉积金钯铜合金镀层具有化学稳定性良好、导电率高、耐磨性、可焊性及耐高温性能优良的特点,常被用于改善许多零部件的表面性能,在功能材料和装饰性电镀方面有广泛的应用前景。传统的氰化物镀金镀液具有覆盖能力高、分散能力强、电流效率高、镀液稳定性好、镀层结晶细致等优点。但是由于氰化物是剧毒的化学药品,对环境和工作人员构成巨大的威胁,因此,研发出安全、环保的无氰电镀液是电镀金及其合金技术的最新研究方向。本文通过单因素法优化了前处理强浸蚀工艺规范。以亚硫酸盐、柠檬酸盐为络合剂,亚硫酸金钠、二氯二铵合钯、硫酸铜为主盐、EDTA为金的稳定剂、硫酸钾为导电盐、硼砂为pH调节剂,开发了无氰亚硫酸盐电镀金钯铜工艺初始配方。同时,研究了搅拌速度、温度、pH、脉冲电镀工艺参数(电流密度、占空比、脉冲频率)对镀层以及镀液性能的影响,通过单因素法确定了最优工艺条件为：pH=9、温度=50℃、搅拌速度1000r/min.占空比=10%、频率=900Hz、电流密度Ak=O.5A/dm2。并利用正交试验确定了电镀金钯铜合金最优工艺配方：金(以亚硫酸金钠形式加入)10g/L、二氯二铵合钯8g/L、硫酸铜1g/L、亚硫酸钠140g/L,EDTA30g/L,柠檬酸铵80g/L,硫酸钾60g/L、硼砂30g/L。使用正交最优配方电镀,镀层表面光亮均匀,呈玫瑰金色,镀层硬度264Hv0.1,与铂铱丝接触电阻216mQ,镀层结合力和耐蚀性良好,镀层成分Au90.4.wt％,Pd4.5wt％, Cu5.1wt％,镀液电流效率达到79%,分散能力82.17%,覆盖能力84.52%,镀液稳定性40天.该工艺得到的镀层质量良好,镀液具有较好的分散能力、覆盖能力、稳定性,并且镀液中不含氰化物,满足生产需求。更多还原

【Abstract】 The Au-Pd-Cu alloy’s electrochemical deposition plating has excellent chemical stability, electrical conductivity, weldability and high temperature performance. It is an excellent plating for improving the surface properties of various components, so it has a wide range of applications in functional materials and decorative plating. The traditional cyanide plating bath has good dispersion capacity coverage, high current efficiency, good stability and fine crystalline coating. However, it poses a huge threat to the environment and staff due to its highly toxic. Therefore, the development of safe, environmentally friendly and non-cyanide plating solution is the new research direction of gold plating technology.In this paper, optimized the strong etching process specification of pretreatment by single factor method. Sulfite and citrate are the complexone, ammonium gold sulfite, sodium dichloro palladium and copper sulfate is the main salt, EDTA is a stabilizing agent for gold, potassium is a conductive salt, borax is a pH adjusting agentand. Researched and developed the initial processing formulation of non-cyanide sulfite for plating the alloy of Au-Pd-Cu. At the same time, the paper studyed the impact of stirring speed, temperature, pH and pulse plating process parameters (current density, duty cycle, pulse frequency) to the plating and plating bath performance. By single factor method to determine the optimum conditions:pH=9, temperature=50℃, the stirring speed=l000r/min, duty cycle=10%, frequency=900Hz, current density Ak=0.5A/dm2. The optimum formulation of the Au-Pd-Cu alloy plating determined by orthogonal test is Au(added in the form of sulfite gold sodium) lOg/L, Pd(NH3)Cl28g/L, CuSO4lg/L, Na2SO3140g/L, EDTA30g/L, Ammonium citrate80g/L, K2SO460g/L、Borax30g/L. Electroplated by the orthogonal optimal formula, the surface of plating layer is brightly golden color and uniform, plating hardness is264HvO.1, contact resistance is216mΩ, plating layer has good adhesion and corrosion resistance. The plating layer composition is Au90.4wt%Pd4.5wt%Cu5.1wt%, The plating solution current efficiency reached79%, dispersion capacity is82.17%, the coverage ability is84.52%, the stability of the bath is40days.The quality of the plating using the process specifications is good. The plating solution has a good dispersing ability, covering ability, stability and cyanide-free plating solution, the process meets the manufactural requirements.更多还原