【作者】 王建；

【导师】 邹雪城；

【作者基本信息】 华中科技大学 ， 集成电路工程， 2011， 硕士

【摘要】 三维芯片堆叠封装是一种具有众多优势的系统集成方式,而芯片互联技术是实现三维堆叠系统的关键技术。本文研究用于三维堆叠封装的高性能电感耦合无线互联技术,研究并设计了一款寄生效应小、通讯质量高、成本低廉、高性能的电感耦合无线互联收发器模块。本文首先介绍了电感耦合无线互联基本通讯原理,并着重分析了多芯片间如何进行正常的数据通讯和传输,以及收发器模块的工作原理和数字控制芯片的控制原理;然后重点叙述了收发器结构、多层金属螺旋电感、Single-Ended发射器和反向不归零信号处理收发器的设计。为了方便测试,在发射器中采用了电流控制器,并且在接收器中加入了信号放大器以及整理电路来提高信号的接收能力和降低信号的失真;最后完成了电路的具体参数设计,并进行了仿真分析。本文的设计在Linux平台和cadence环境下,采用hejian₀.25um_CMOS工艺,对电感耦合无线互联的收发器模块进行设计与仿真。结果显示,本文设计的这种多芯片间电感耦合无线互联收发器模块,发送的测试信号与接收到的信号基本完全一致,无明显失真现象。这表明本文设计的这种电感耦合无线互联的收发器模块通讯的质量高、寄生效应小,达到了较高的水平。更多还原

【Abstract】 Three-dimensional stacked encapsulating of chips is a kind of method of system integration which possesses many advantages, and chips-superconnect technique is the key to achieve three-dimensional stack. The high-performance inductive coupling wireless connection technique used to three-dimensional stacked encapsulating studies and designs the transceiver module of inductive coupling wireless connection. The transceiver module is possessed of little parasitic effect, high-quality communication, low cost and high performance.At first, the basic communication theory of inductive coupling wireless connection is introduced and the formal statistic communication and transmission among several chips is analyzed. In the following, the working principle of transceiver module and the controlling principle of number controlling chips are presented. And then the design of transceiver module, multilevel metallic spiral inductor, Single-Ended emitter and nonreturn-to-zero processing transceiver are stated in the article. For help to test, the current controller is adopted in emitter and signal amplifier and sorted circuit are added in transceiver to enhance the received capability and reduce the deformation of signals. In the end, the proportion between width and length of each MOS is introduced in designing circuit and the circuit of transceiver module is simulated and analyzed.In the platform of Linux and the environment of cadence, the Hejian ₀.25um_CMOS technique is adopted to simulate and analyze the transceiver module of inductive coupling wireless connection. According to the result, the dispatching and received signals sent by the transceiver module of inductive coupling wireless connection proposed in this article are basically the same and do not deform. The phenomenon shows that the transceiver module of inductive coupling wireless connection possesses high quality and little parasitic effect and has reached a higher level.更多还原