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工程陶瓷超精密平板研抛技术的研究
Study on Polishing Technology of Engineering Ceramics Ultra-precise Plate
【作者】 赵明利;
【导师】 赵波;
【作者基本信息】 河南理工大学 , 机械制造及其自动化, 2007, 硕士
【摘要】 工程陶瓷具有高强度、高硬度、高耐磨性和耐高温等优良特性,与金属和复合材料一起被称为现代工程材料的三大支柱,但由于陶瓷材料的难加工特性,在很大程度上限制了陶瓷材料在高科技领域的推广应用。针对工程陶瓷材料及超声波的特性,将超声波应用于工程陶瓷材料的精密加工。根据局部共振理论,设计制作了适合二维超声研抛大平板的声学系统,并对工装的振动性能进行试验;应用压痕断裂力学理论,对硬脆材料的去除机理进行分析研究,并对不同加工条件下,试件质点的运动情况以及单颗磨粒的相对运动轨迹进行分析模拟,发现在y方向施加超声时,其轨迹不同于普通研抛时单颗磨粒的直线形运动轨迹,而是有一定振幅的正弦曲线,说明在二维超声振动研抛时,其磨粒划痕比普通研抛时的磨粒划痕宽,从而证明二维超声研抛的高效性机理;通过工程陶瓷的研抛力试验研究,发现在相同加工条件下超声振动研抛力小于普通研抛力;通过对研抛后表面粗糙度进行对比,分析不同的加工参数对表面粗糙度的影响,通过正交试验和多元线性回归分析研究了各研抛参数对表面粗糙度影响的显著程度,得出了最佳研抛参数,给出表面粗糙度的试验公式;通过电镜试验,揭示了磨削与研抛的本质区别,并进一步说明了超声研抛优于普通研抛,超声研抛时材料以细碎的方式去除,并且表面出现的凹坑相对较浅,较为平整的平面面积相对较大。试验研究表明,将超声应用于研抛技术,对工程陶瓷而言是一种高效的加工方法。
【Abstract】 Engineering ceramics has high-intensity, high hardness, high-wearing feature and resistance to elevated temperature etc. eminent characteristics. Together with metal and complex material, they have been entitled as three big supports of modern engineering materials, however, because it is difficult to machine, it is largely limited to popularize and apply in high scientific and technical field.In allusion to engineering ceramics and ultrasonic wave characteristics, ultrasonic wave is applied to precision machining of engineering ceramics. In this paper, according to local resonance theory, the sound system has been designed and produced, which adapt to two-dimension ultrasonic polishing big plate. And vibration performances of the device have been putted to test; By means of indentation fracture mechanics, it studies on the removal mechanism of hard-brittle material, and analyses and simulates the mass point motion of sample and single grain trace under different machining conditions, and finds that when adding ultrasonic vibration in y-direction, the single grain traces are sinusoidal curves with a amplitude which is different to line traces of common polishing, which can show that two dimension ultrasonic polishing scratch marks of abrasive grains is wider than common polishing, thereby, high efficiency mechanism of two dimension ultrasonic polishing is proved; Through the polishing force experiment of engineering ceramics, it finds that ultrasonic polishing forces are less than common polishing under same machining conditions; Trough comparing polishing surface roughness, it analyses influences of different parameters on surface roughness. With orthogonal test and multivariate linear regression analysis, the significance levels of parameters on surface roughness are presented, the optimum polishing parameters of ultrasonic vibration polishing are put forward, and the experimental formula of surface roughness is gained; Through electron microscopic experiment, it discloses the essential distinction between grinding and polishing, and further explains that ultrasonic polishing surpasses common polishing. When ultrasonic polishing, material is removed by fine-crush mode, and pits in its surface are relatively shallower, and flat surface is relatively bigger. Trough experimental investigation, it can be proved that applying ultrasonic to polishing is a high efficiency method to engineering ceramics.
【Key words】 Engineering ceramics; Ultrasonic vibration; Trace of abrasive grain trace; Roughness; Microscopic quality;