【作者】 张晓明；

【导师】 解光军；

【作者基本信息】 合肥工业大学 ， 微电子学与固体电子学， 2007， 硕士

【摘要】 本文对一种高频、高效的电流控制模式DC-DC单片开关电源进行建模与设计。采用0.35um CMOS工艺制程,有效输入范围为2.6V～9V,输出电压在6V～13V范围内可调。芯片内置1.2MHz振荡器,具有软启动、欠压、过压、过温和过流等保护功能,输出电流也可根据应用需求自由调节,配以简单的外部元件即能构成完整的开关电源。在电路设计中,作者首先阐述了电流控制模式开关电源的基本工作原理,对比了电流控制与电压控制两种模式的优缺点,并根据设计要求进行了电路的总体结构设计,然后提了一种统一的电流控制模式开关电源SPICE模型,适用于连续电感电流和不连续电感电流两种工作模式,以指导后面各个子电路与整个芯片的参数设计,最后给出版图设计与流片测试结果。限于文章篇幅,作者有选择地分析了带隙基准源、LDO(Low Drop Out Voltage Regulator,低压差线性稳压器)、电流检测与斜率补偿、振荡器和PWM比较器五个子电路模块。在完成原理分析与电路设计的基础上,本文应用EDA软件HSPICE对SPICE模型、各个子电路模块和整体电路进行了功能仿真及量化模拟,并将仿真结果与流片实测结果对比,各项参数达到或优于预定指标,验证了作者所阐述的电流控制模式DC-DC变换器的建模和设计理论,是集成电路设计理论与流片实践相结合的有价值的尝试。更多还原

【Abstract】 A high-frequency and high-efficiency monolithic switching regulator in current-mode implemented with 0.35um CMOS process is analyzed in this paper. The chip has a wide input voltage range of 2.6V to 9V to generate adjustable output voltage range of 6V to 13V. A 1.2MHz oscillator circuit is imbedded and along with the function of soft-start. The chip also has some interior protection functions such as UVLO(Under-Voltage Lockout), OVP(Over-Voltage Protection), OTP(Over-Temperature Protection) and OCP(Over-Current Protection). The output current is adjustable simply by changing the external circuits to meet customers’ requirements.During the circuit design, the basic principle of switching regulator in current-mode is introduced at first. Then, the comparison between current-mode and voltage-mode is presented in the thesis. As a result, we can comprehend the merits and drawbacks of these two topologies in order to use them freely and specify a new topology of chip according to customer’s requirements. A generalized SPICE model for current-mode DC-DC converter operating in DCM(Discontinuous Current Mode) and CCM(Continuous Current Mode) is proposed. With the guide of SPICE model the author designed all modules and several sub-circuits, such as Bandgap Reference, LDO, Current-Sense , Slope Compensation, Oscillator and PWM Comparator are analyzed.Based on the principle analysis and circuit design in the beginning chapters, the author simulated the SPICE model and some sub-circuits and the whole chip circuits in top level using EDA tools HSPICE. The wafer test results after MPW(Multi-Project Wafer) and Full Mask tape-out indicate that the IC(integrated circuit) has met the design specification, both functional targets and electrical characteristics.更多还原