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SnO2-CuO-Sb2O3电极陶瓷的制备及其性能研究

Study on Preparation and Performance of SnO2-CuO-Sb2O3 System Electrode Ceramics

【作者】 李捷

【导师】 沈强;

【作者基本信息】 武汉理工大学 , 光电子及信息材料, 2007, 硕士

【摘要】 密实SnO2电极陶瓷材料具有良好导电性能和抗玻璃液侵蚀性能,是玻璃电熔技术的关键组成部分。论文以SnO2、CuO、Sb2O3粉体为原料,采用无压烧结技术制备含CuO与Sb2O3复合添加剂的SnO2基电极陶瓷材料,并系统研究其相关性能。烧结致密化研究表明,CuO的最佳添加量为0.5~1.0mol%。当CuO含量为0.5或1.0mol%,Sb2O3含量不宜超过CuO。SnO2-CuO-Sb2O3电极陶瓷的烧结致密化有两种情况:一是当Sb2O3含量少于CuO含量时,在晶界区域的CuO在高温时产生富铜的液相起到粘结作用占主导地位,促进SnO2基陶瓷烧结致密化;二是当Sb2O3含量多于CuO含量时,与SnO2发生固溶反应占主导地位,抑制SnO2基陶瓷烧结致密化。电学性能测量结果表明,SnO2-1.0mol%CuO-1.0mol%Sb2O3电极陶瓷具有良好的综合导电性能,其室温温电阻率为5.87×10-2Ω·cm,700℃中温电阻率为5.96×10-3Ω·cm。当SnO2-CuO-Sb2O3。陶瓷材料未烧结致密时,增加CuO含量,增加载流子迁移率,进而导致电阻率降低;当SnO2-CuO-Sb2O3陶瓷材料已烧结致密时,增加CuO含量增加晶界富Cu相的厚度,使得载流子迁移率下降,从而导致电阻率升高。力学强度测量结果表明,当Sb2O3含量不超过CuO含量时,Sb2O3的加入增加了SnO2-CuO-Sb2O3基电极陶瓷的抗弯强度,主要原因是与SnO2发生的固溶反应导致了晶粒的细化。SnO2-0.5mol%CuO-0.25mol%Sb2O3电极陶瓷材料的抗弯强度达到最高值190MPa。采用玻璃液侵蚀静态测量方法测量SnO2-CuO-Sb2O3基电极陶瓷在1200℃的钠钙玻璃液的侵蚀速率,结果表明SnO2-CuO-Sb2O3基陶瓷具有良好的抗玻璃液侵蚀能力。当Sb2O3的含量在0.1~1.0mol%时,SnO2-1.0mol%CuO-Sb2O3基电极陶瓷玻璃液侵蚀速率在3~4×10-4mm/h之间。

【Abstract】 Dense SnO2 based electrode ceramics with excellent conductive property and good corrosion resistance to molten glass is the very important component of glass electric-melting industry.In this paper, SnO2 based electrode ceramics of high performances simultaneously doped with CuO and Sb2O3 is prepared by pressureless sintering. In SnO2-CuO-Sb2O3 electrode ceramics, optimal concentration of CuO is 0.5mol%~1.0mol%, the concentration of Sb2O3 is not exceeding to CuO. When concentration of Sb2O3 is lower than CuO, because liquid phase sintering mechanism of rich Cu phase is dominate, densification is promoted. On the contrary, solid solution reaction of Sb2O3 and SnO2 will restrain densification.Results of measuring resistivity of SnO2-CuO-Sb2O3 electrode ceramics show that SnO2-1.0mol%CuO-1.0mol%Sb2O3 ceramics has the best electric-conductive property. Room temperature resistivity is reduced to 5.87×10-2Ω·cm, and resistivity at 725℃is 5.96×10-3Ω·cm. When ceramics is not dense, increasing of CuO improves carrier mobility, then decreases resistivity. When ceramics is dense, increasing of CuO decreases carrier mobility, then enhances resistivity.Sb2O3 improves bend strength and decreases corrosion resistance to molten Na&Ca-glass(1200℃) of SnO2-CuO-Sb2O3 electrode ceramics. Bend strength of SnO2-0.5mol%CuO-Sb2O3 electrode ceramics arrives to 185~190MPa. As concentration of Sb2O3 is lower than CuO, corrosion rates of SnO2-1.0mol% CuO-Sb2O3 electrode ceramics are decreased to 3~4×10-4mm/h, lower than the results reported by the references.

  • 【分类号】TM28
  • 【被引频次】2
  • 【下载频次】124
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