【作者】 唐裕霞；

【导师】 曹志峰； 王立军； 刘景和；

【作者基本信息】 长春理工大学 ， 凝聚态物理， 2004， 硕士

【摘要】 大功率半导体激光器列阵研制的关键问题之一就是散热技术。为了提高激光器的输出功率、可靠性和稳定性，本论文选取有源热沉——微通道热沉来冷却大功率半导体激光器列阵。根据传热学和流体力学理论，本论文对微通道热沉进行了热流模型分析，理论推导了微通道热沉的热阻。通过分析，对微通道热沉材料、冷却液、微通道热沉的结构参数以及热沉与激光器列阵条的封装等进行了优化设计。根据实际制作条件，设计了五层结构微通道热沉，采用深层光刻分离曝光化学腐蚀技术、机械加工技术和铜直接粘接技术(DBC)制备出冷却大功率半导体激光器迭阵的无氧铜微通道热沉。通过测试，所制得的无氧铜微通道热沉冷却半导体激光器的总热阻为0.645~0C／W，与理论分析基本吻合，满足散热要求。更多还原

【Abstract】 One of the key problems is lasers cooling in researching high power semiconductor diode laser arrays. In order to increase the output power, reliability and stabilization, microchannel heatsink which is one of active heatsinks is used to cool high power semiconductor diode laser arrays in the paper. According to heat transfer and hydrodynamics, the thermal flow dynamics and the thermal resistance microchannel heatsink are analyzed. Based on the analysis, the heat sink materials, cooling liquid, the heatsink structure, and the bonding of laser bar are optimized in order to increase the transfer efficiency. Considering the practical manufacturing condition, an Oxygen-free copper microchannel heatsink consisting of five copper sheets is designed and fabricated utilizing the technology of deep photolithography, mechanical machining, and bonding with medium. By testing, the total thermal of the microchannel heatsink for cooling high power semiconductor diode laser arrays is 0.645℃/W, which is consistent with the result of theory counting.更多还原