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丙烯酸酯基导电压敏胶研究进展

Research progress in acrylate-based conductive pressure sensitive adhesive

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【作者】 徐丹张军营牛栋华宋佳赟刘彤程珏

【Author】 Xu Dan;Zhang Junying;Niu Donghua;Song Jiayun;Liu Tong;Cheng Jue;Beijing Tianyu Aerospace New Material Technology Co.,Ltd.;College of Materials Science and Engineering,Beijing University of Chemical Technology;

【通讯作者】 张军营;

【机构】 北京天宇航天新材料科技有限公司北京化工大学材料科学与工程学院

【摘要】 综述了丙烯酸酯基导电压敏胶的三类填料的研究进展,包括金属填料、无机非金属填料以及杂化填料。对丙烯酸酯基导电压敏胶的结构设计进行了汇总,包括在丙烯酸酯基础上接入氨基甲酸酯键、环氧基团的导电压敏胶。最后对丙烯酸酯基导电压敏胶未来发展进行了展望。

【Abstract】 The research progress of three types of fillers for acrylate-based conductive pressure sensitive adhesive,including metal fillers,inorganic non-metallic fillers,and hybrid fillers were reviewed. The structural design of acrylate-based conductive pressure sensitive adhesive,which includes accessing to urethane bond and epoxy group on the basis of acrylate-based conductive pressure sensitive adhesive was summarized. Finally,the future development of acrylate-based conductive pressure sensitive adhesive was prospected.

  • 【文献出处】 中国胶粘剂 ,China Adhesives , 编辑部邮箱 ,2024年04期
  • 【分类号】TQ436.3
  • 【下载频次】26
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