【摘要】 通过低温扩散连接方法实现钨合金(90W-7Ni-3Cu)与304不锈钢的高性能连接。采用扫描电镜(SEM)、能谱(EDS)、电子探针(EPMA)分析连接界面的微观组织及元素扩散与分布行为，采用拉伸试验测试连接界面的力学性能。研究结果表明：在800～950℃、压力20 MPa、保温120 min的条件下，可以实现90W-7Ni-3Cu合金与不锈钢的有效连接；当连接温度为900℃时，连接界面抗拉强度达到最大值168 MPa；连接界面结合紧密，无裂纹等缺陷。钨合金与不锈钢界面原子形成了充分的互扩散，不锈钢中的W、Fe、Cr、Ni和Si元素借助空位以及点缺陷扩散到了钨合金一侧的钨中，形成了富含W、Fe、Cr、Ni和Si元素的扩散层。900℃连接样件的断裂发生在钨合金一侧，可以观察到钨合金基体的六角形晶界并且其表面覆盖有粗糙的黏着物，黏着物为原子扩散所形成的扩散层。不锈钢中的Cr、Fe元素以固溶的方式扩散到了钨合金的(Ni,Cu)相中，提高连接界面强度。更多还原

【Abstract】 The high-performance connection between tungsten alloy(90W-7Ni-3Cu) and 304 stainless steel was realized by low-temperature diffusion bonding. Scanning electron microscopy(SEM), energy dispersive spectroscopy(EDS) and electron probe microanalyzer(EPMA) were used to analyze the microstructure, element diffusion and distribution behavior of the connection interface. The mechanical properties of the connection interface were tested by tensile test. The results show that the effective connection between 90W-7Ni-3Cu alloy and stainless steel can be achieved with the conditions of 800-950 °C, pressure of 20 MPa and heat preservation of 120 min. When the connection temperature is 900 °C, the tensile strength of the connection interface reaches the maximum value of 168 MPa. The connection interface is tightly bonded without defects such as cracks. The atoms at the interface between the tungsten alloy and the stainless steel have formed sufficient interdiffusion, and the elements of W, Fe, Cr, Ni and Si in the stainless steel diffuse into the tungsten on the side of the tungsten alloy by means of vacancies and point defects, forming a rich Diffusion layer containing W, Fe, Cr, Ni and Si elements. The tensile fracture of the interface of the connected sample at 900 °C, occurs on the side of the tungsten alloy, and the hexagonal grain boundary of the tungsten alloy matrix can be observed and its surface is covered by rough adhesives. The adhesives are analyzed as a diffusion layer formed by the diffusion of atoms. The Cr and Fe elements in the stainless steel diffuse into the(Ni, Cu) phase of the tungsten alloy in the form of solid solution to improve the strength of the bonding interface.更多还原