【摘要】 为了有效检测胶接结构缺陷，构建了基于声阻法的成像检测系统.系统包括声学信号采集、声学探头定位、数据处理及绘图三部分.利用两轮式编码器，实现了动态扫查过程探头位置信息的采集；利用结合质量检测仪采集缺陷信息；采用C++编写了数据处理及图像绘制程序，实现了胶接结构缺陷声阻法实时成像检测.利用声阻法及常规超声C扫描成像方法对铝合金/环氧树脂/铝合金三明治胶接结构进行了检测，并对检测结果进行了分析对比.结果表明，声阻法能更有效识别胶接结构中的缺陷，且单面检测即可满足缺陷表征需求.更多还原

【Abstract】 In order to detect the bonded structure defects effectively, an imaging inspection system based on acoustic impedance method is constructed. The system includes three parts: acoustic signal acquisition, acoustic probe positioning,data processing and imaging. Probe positions during dynamic scanning are collected using two rotary encoders. The defect data are collected using a Bonding Quality Detector. The data processing and image drawing programs are written in C++ language. The bonded sandwich structure of aluminum alloy/epoxy resin/aluminum alloy was tested using both acoustic impedance and conventional ultrasonic C-scan imaging methods, and the test results were compared and analyzed. The results show that the acoustic impedance based imaging method can identify defects in bonded structures more effectively,and single-sided testing can meet the needs of defect detection.更多还原