【摘要】 高可靠集成电路多采用AuSn20焊料完成密封,在熔焊过程中焊缝区域往往产生密封空洞,这对电路的气密性和盖板焊接强度产生影响,从而造成可靠性隐患。介绍了Au Sn20焊料密封陶瓷外壳的过程,阐述了两种从不同方向制样和观察密封空洞的方法,列举了环状空洞、扇形空洞、气泡状空洞等几种典型空洞,并阐述了这几种空洞的微观形貌、形成机理及抑制措施。更多还原

【Abstract】 For highly reliable integrated circuits, Au Sn20 solder is often used to complete the sealing. Sealing voids are often generated in the weld area during the fusion welding process, which affects the air tightness of the circuit and the welding strength of the cover plate, thereby causing reliability risks. Au Sn20 sealing is introduced. The process of the ceramic shell expounds two methods of sample preparation and observation of sealing voids from different directions. Several typical voids such as ring voids, fan-shaped voids and bubble-like voids are listed, and the microscopic appearance formation mechanism and suppression measures of these voids are explained.更多还原