【摘要】 提出了一种基于OCR技术的半导体封装测试生产自动化解决方案。通过二值化、字符分割、特征提取、模板匹配等方法获取机台设备屏幕参数,实现了Recipe的上传和下载、参数获取、设备状态实时监控、远程发送操作指令等。通过企业的实际应用表明,该方案在一定程度上提高了半导体封装测试的自动化生产水平。更多还原

【Abstract】 It introduces a new automation solution based on OCR technology for improving the automation level of the whole semiconductor packaging and testing industry. Based on binarization, character segmentation, feature extraction, template matching and other methods to acquire screen parameters of machine equipment, it realizes Recipe upload, download, parameter acquisition, real-time monitoring of device status, remote transmission of operation instructions and other functions. The application in the actual enterprise shows that the solution improves the automatic production level of the whole semiconductor packaging and testing industry.更多还原