【摘要】 应用CX-UAM-1型金属超声波固接装置,对0.2mm厚度的T4纯铜箔材与6061铝合金进行固相连接,获得Cu/Al异种金属带状材料在特定工艺参数下的固接接头.试验研究在特定参数范围内,改变工艺参数固接过程静压力、振子输出振幅等值对Cu/Al固接件性能的影响情况.采用扫描电镜观测表面形貌情况,通过维氏硬度试验分析表面硬度变化情况,通过摩擦磨损试验测出摩擦系数变化情况.结果表明,振子输出振幅相同时,压力变大,固接箔材表面更为光滑平整.压力相同时,振子输出振幅变大,金属表面的颗粒变大且数量增多.试验范围内,带状Cu/Al箔材固接的最佳工艺参数为压力1.5kN,振子输出振幅30μm.更多还原

【Abstract】 The application of CX-UAM-1 metal ultrasonic bonding device,the thickness of 0.2 mm T4 pure copper foil and 6061 aluminum alloy for solid connection,Cu/Al heterogeneous metal strip material under the specific process parameters of the bonding joint.The effects of changing process parameters,such as static pressure and the equivalent vibration amplitude,on the properties of Cu/Al bonding parts were studied experimentally.The surface morphology was observed by scanning electron microscopy.The surface hardness changes were analyzed by vickers hardness test.The change of friction coefficient was measured by friction and wear test.The experimental results show that,with the same vibration amplitude,the pressure increases,and the surface of the bonding foil becomes smoother.At the same pressure,the amplitude of the oscillator increases and the particles on the metal surface increase.Within the test range,the optimal technological parameters for the banded Cu/Al foil bonding are pressure 1.5 kN,and the oscillator amplitude is 30 μm.更多还原