【摘要】 微机电系统封装过程中产生的应力会影响其封装效果与使用寿命,针对微晶玻璃与不锈钢阳极键合温度引起的残余应力问题,采用MARC有限元软件对微晶玻璃与不锈钢键合冷却过程模拟。分析了微晶玻璃与不锈钢在不同厚度比值与面积比值键合结构下的残余应力分布规律。结果表明:微晶玻璃与不锈钢厚度比值越小,最大残余应力越小;随着不锈钢与微晶玻璃面积比值的增大,残余应力逐渐趋于平稳。研究结果为改善微晶玻璃与不锈钢阳极键合质量提供了理论参考与设计依据。更多还原

【Abstract】 The stress generated in the process of MEMS packaging will affect the sealing effectiveness and service life.The MARC finite element software is used to simulate the cooling process of anodic bonding between glass-ceramic and stainless steel in this paper,and solve the problem about residual stress caused by the bonded temperature.Meanwhile analyze the residual stress distribution in different thickness ratios and area ratios of anodic bonded structure between glass-ceramic and stainless steel.The results show that glass-ceramic and stainless steel thickness ratio is smaller,the smaller the maximum residual stress.With the increase of stainless steel and glass-ceramic area ratios,residual stress trend to reduce gradually.The result provides a theoretical basis and design reference to improved glass-ceramic and stainless steel anodic bonding quality.更多还原