【摘要】 采用电子背散射衍射(EBSD)技术,着重研究了固溶温度对新型耐热合金晶界特性的影响。结果表明:该新型合金在1125~1200℃固溶处理时,随固溶温度升高至1200℃,晶界数量和长度降低,平均晶粒尺寸增加至约205μm;同时,随固溶温度升高,合金中的大角度晶界频率降低,小角度晶界频率提高,且大角度晶界中重位点阵晶界频率降低。更多还原

【Abstract】 Effect of solution temperature on grain boundary character in new heat-resistant alloy was investigated by EBSD technology. The results show that the average grain size increases normally with the increase of solution annealing temperature from 1125 ℃ to 1200 ℃. At1200 ℃,the average grain size is about 205 μm. With the increase of solution temperature,the frequency of large angle grain boundary decreases and the frequency of small angle grain boundary increases. And the frequency of the coincident site lattice( CSL) boundaries decreases in large angle grain boundaries.更多还原