【摘要】 采用溶剂法在430⁵30℃分别在Q235钢基体上制备了热镀Galfan合金镀层,运用扫描电镜、X射线衍射仪分析了浸镀温度对合金镀层界面组织的影响。结果表明:浸镀温度为430⁴50℃时,界面层生长速度缓慢;当温度高于470℃时,界面层生长速度变快,高温时界面层的生长速度为低温界面层生长速度的2倍。浸镀温度为430⁴50℃时,界面层分为两层,远离基体部分为圆片状组织,尺寸为1³μm;靠近基体部分为椭球状组织,尺寸约为几百纳米。浸镀温度为470⁵30℃时,界面层全部为椭球状组织,尺寸为3⁶μm。其中圆片状组织为FeAl₃相,椭球状组织为Fe₂Al₅Zn_0.4组成。随着浸镀温度的提高,界面层组织晶粒逐渐变大。更多还原

【Abstract】 Galfan alloy coating was prepared on Q235 steel surface by solvent method at 430-530 ℃.The effect of hot-dipping temperature on interface microstructure of the alloy coating was analyzed by means of scanning electron microscopy and X-ray diffractometer.The results show that when hot-dipping temperatures are between 430-470 ℃,the growth rate of the interface layer is slow,and when the temperature is higher than 470 ℃,the growth rate is faster.The growth rate of the interface layer at high temperature is twice as high as that at low temperature.The microstructure of the interface layer is divided into two layers at dipping temperature of 430-450 ℃,and the part away from substrate is FeAl₃ phase,of which the size is 1-3 μm,and the part near the substrate is Fe₂Al₅Zn_0.4phase with the size of about several hundred nanometers.When hot-dipping is done between 490-530 ℃,the microstructure of the interface layer is Fe₂Al₅Zn_0.4phase,and the size is 3-6 μm.The disc structure is FeAl₃ phase,and the ellipsoidal structure is Fe₂Al₅Zn_0.4.With the increasing of dipping temperature,the grain size of the interface layer increases.更多还原