【摘要】 根据Zeta电势测量、极化曲线测量和原子力显微镜观察的结果,探讨了盐酸胍（GH）在Ru化学机械抛光（CMP）过程中的作用。结果表明:在pH=9的5%SiO₂+0.15% H₂O₂抛光液中,GH的添加可以大幅度提高钌的去除速率。当GH浓度为80 mmol/L时,钌的去除速率最佳。在相同浓度下,GH对Ru去除速率的提高效果优于KCl,皆因GH除了可以提升SiO₂颗粒对Ru表面的机械作用之外,还能加速Ru腐蚀。更多还原

【Abstract】 The effect of guanidine hydrochloride（GH） on chemical mechanical polishing（CMP） of Ru was studied based on the results of Zeta potential measurement, polarization curve measurement and atomic force microscopic observation. The results showed that the removal rate of Ru in 5% SiO₂ + 0.15% H₂O₂ polishing slurry at pH 9 is greatly improved by the addition of GH and optimal when the concentration of GH is 80 mmol/L. With the same concentration, the improvement of Ru removal rate by GH is better than that by KCl, due to the fact that GH not only enhances the mechanical action of SiO₂ particles on Ru surface, but also accelerates the corrosion of Ru.更多还原