【摘要】 介绍了一种利用计算流体动力学分析软件和有限元法多物理场分析软件对功率微波单片集成电路(MMIC)封装进行电热及热力特性数值模拟的方法。首先对功率MMIC封装的热传导路径及等效热模型进行了简化分析,基于简化模型对影响热分布和热传导的因素进行分析,并提取其材料和结构参数,建立功率MMIC封装的热模型,并对一款S波段5 W功率放大器MMIC封装进行仿真,得到功率MMIC及其封装的温度分布,仿真结果均与实际测试结果相吻合。所建立的简化模型和热应力分析对功率MMIC及其封装结构的设计和改进具有指导意义。更多还原

【Abstract】 Using computational fluid dynamics analysis software and finite element method multiphysics analysis software,a method of electric and thermal characteristics numerical simulation for the power microwave monolithic integrated circuit( MMIC) was introduced. Firstly,the thermal conduction path and the equivalent thermal model of the power MMIC packages were analyzed. The factors affecting the thermal distribution and thermal conduction were analyzed based on the simplified model,parameters of the materials and structures were extracted,the thermal model of the power MMIC package was established,and an S band 5 W power ampifier MMIC package was simulated. The temperature distributions of the power MMIC and its package were obtained. A series of simulation results through the numerical analysis were consistent with the experimental testing results. The simplified model and the thermal stress analysis are of important guiding significance for the design and improvement of the power MMIC and package structures.更多还原