【摘要】 在不同基片温度（RT、300、400、500和600℃）下,采用射频磁控溅射法制备了ZnO薄膜和BZN薄膜。研究表明,所制备的BZN薄膜拥有非晶态结构,ZnO薄膜具有c轴择优取向,在基片温度为500℃时,获得低的漏电流（10-7 A/cm²）,比RT时的漏电流（10-4 A/cm²）低三个数量级。将所制备的ZnO薄膜和BZN薄膜分别作为ZnO-TFT的有源层和栅绝缘层,研究表明,在基片温度为500℃时,提高了器件性能,所取得的亚阈值摆幅（470mV/dec.）是RT时的亚阈值摆幅（1 271 mV/dec.）的三分之一;界面态密度(3.21×10¹² cm^-2)是RT时的界面态密度(1.48×10¹³ cm^-2)的五分之一。更多还原

【Abstract】 ZnO and BZN thin films were deposited by RF magnetron sputtering under different substrate temperature from RT to 600 ℃.It can be seen that BZN thin films are amorphous structure,and ZnO thin films has the c-axis preferred orientation.At 500 ℃,the leakage current density of BZN thin film is approximately three order magnitude lower than that of BZN thin film at RT.The sub-threshold awing（470mV/dec.）of ZnO-TFT with BZN thin films as gate insulator and ZnO thin films as active layer is approximately three times lower than that of device（1 271mV/dec.）at RT,and the surface state density(3.21×10¹² cm^-2)of ZnOTFT is approximately five times lower than that of device(1.48×10¹³ cm^-2)at RT.更多还原