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Charge deposition model for investigating SE-microdose effect in trench power MOSFETs

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【作者】 万欣; 周伟松; 刘道广; 薄涵亮; 许军;

【Author】 Wan Xin;Zhou Weisong;Liu Daoguang;Bo Hanliang;Xu Jun;Institute of Nuclear and New Energy Technology,Tsinghua University;Institute of Microelectronics,Tsinghua University;

【机构】 Institute of Nuclear and New Energy Technology,Tsinghua University; Institute of Microelectronics,Tsinghua University;

【摘要】 It was demonstrated that heavy ions can induce large current-voltage(Ⅰ-Ⅴ) characteristics shift in commercial trench power MOSFETs,named single event microdose effect(SE-microdose effect).A model is presented to describe this effect.This model calculates the charge deposition by a single heavy ion hitting oxide and the subsequent charge transport under an electric field.Holes deposited at the SiO2/Si interface by a Xe ion are calculated by using this model.The calculated results were then used in Sentaurus TCAD software to simulate a trench power MOSFET’s Ⅰ—Ⅴ curve shift after a Xe ion has hit it.The simulation results are consistent with the related experiment’s data.In the end,several factors which affect the SE-microdose effect in trench power MOSFETs are investigated by using this model.

【Abstract】 It was demonstrated that heavy ions can induce large current-voltage(Ⅰ-Ⅴ) characteristics shift in commercial trench power MOSFETs,named single event microdose effect(SE-microdose effect).A model is presented to describe this effect.This model calculates the charge deposition by a single heavy ion hitting oxide and the subsequent charge transport under an electric field.Holes deposited at the SiO2/Si interface by a Xe ion are calculated by using this model.The calculated results were then used in Sentaurus TCAD software to simulate a trench power MOSFET’s Ⅰ—Ⅴ curve shift after a Xe ion has hit it.The simulation results are consistent with the related experiment’s data.In the end,several factors which affect the SE-microdose effect in trench power MOSFETs are investigated by using this model.

  • 【文献出处】 Journal of Semiconductors ,半导体学报(英文版) , 编辑部邮箱 ,2015年05期
  • 【分类号】TN386
  • 【被引频次】2
  • 【下载频次】43
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