【摘要】 多晶硅生产的还原炉壁体热反射率的高低对电能消耗有很大的影响,过去,少有相关的研究报道。使用亚硫酸盐体系对还原炉内壁电镀金,研究了镀金电流密度、镀覆时间等对镀金层光亮度、热反射率的影响;探讨了镀液中配位剂亚硫酸钾浓度对镀层显微硬度、沉积速率及阴极电流效率的影响。结果表明:电流密度为0.4A/dm2,镀覆时间为10 min时镀金层外观质量最好,亚硫酸钾浓度为100 g/L时镀金层的显微硬度、阴极电流效率和沉积速率达到最大值;镀金层的光亮度与电流密度和镀覆时间有很大关系;镀金层的热反射率比不锈钢基体的高,光亮镀层的热反射率比半光亮镀层的高;镀液中亚硫酸钾含量的变化使得镀金层的显微硬度和沉积速率发生了改变。更多还原

【Abstract】 A sulfite bath was adopted to conduct gold electroplating of the inner wall of the reduction furnace used for polysilicon production.The effects of current density and plating time on the brightness and heat reflectivity of as-plated Au coating were investigated,while the dependence of microhardness,deposition rate and cathodic current efficiency of the Au coating on the concentration of potassium sulfite was also examined.It was found that the Au coating obtained under a current density of 0.4 A/dm2 and a plating time of 10 min exhibited the best appearance.Besides,the microhardness,deposition rate and cathodic current efficiency of the Au coating reached the maximum when the concentration of potassium sulfite in the plating bath was kept at 100 g/L.Moreover,the brightness of Au coating was closely related to the current density and plating time,and its heat resistivity was higher than that of the stainless steel substrate but lower than that of semi-bright Au coating.In addition,the change in the concentration of potassium sulfite in the plating bath led to changes in the microhardness and deposition rate of the Au coating.更多还原