节点文献
铈基、硅基半导体抛光液的发展概况
The Developments of Ceria-based and Silicon-based Semiconductor Polishing Solutions
【摘要】 介绍了化学机械抛光液的研究进展和抛光原理,分析了化学机械抛光过程中抛光液的重要作用,阐述了配制化学机械抛光液的两种方法,分析了影响铈基抛光液和硅基抛光液抛光性能的诸多因素。最后指出了抛光液回收再利用的重要性和可行性。
【Abstract】 The article introduced the research progress and polishing principle of the chemical mechanical polishing solution,and analyzed the importance of the polishing solution in the chemical mechanical polishing process.Two preparation process of the chemical mechanical polishing solution was elaborated.The influence factors on ceria-based and silicon-based polishing solution were analyzed.At last,the paper presented the importance and feasibility of polishing solution recycling.
【关键词】 化学机械抛光;
CeO2抛光液;
SiO2抛光液;
【Key words】 chemical mechanical polishing; cerium oxide polishing solution; silica polishing solution;
【Key words】 chemical mechanical polishing; cerium oxide polishing solution; silica polishing solution;
【基金】 国家“863”项目(2010AA03A407);内蒙古科技厅项目(2010B1658);包头市科技局项目(2011J1004);内蒙古科技大学创新基金项目(2010NC062)
- 【文献出处】 稀土 ,Chinese Rare Earths , 编辑部邮箱 ,2013年02期
- 【分类号】TN305.2
- 【被引频次】2
- 【下载频次】328