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OLED-on-silicon chip with new pixel circuit

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【作者】 刘艳艳耿卫东代永平

【Author】 LIU Yan-yan1,2,GENG Wei-dong1,2,DAI Yong-ping1,2 1.Tianjin Key Laboratory for Photoelectronic Thin Film Devices and Technology,Nankai University,Tianjin 300071,China 2.Key Laboratory of Opto-electronic Information Science and Technology(Nankai University,Tianjin University),Ministry of Education,Tianjin 300071,China

【机构】 Tianjin Key Laboratory for Photoelectronic Thin Film Devices and Technology,Nankai UniversityKey Laboratory of Opto-electronic Information Science and Technology(Nankai University,Tianjin University),Ministry of Education

【摘要】 A low power 640×480 OLED-on-silicon chip design that used in microdisplay was presented.A novel pixel circuit was proposed to meet the special requirement of OLED-on-silicon.The novel pixel consists of three transistors and one capacitor(3T1C).It has simple structure and can effectively reduce the current glitch generated during the AC driving from 55 μA to 7.5 μA,so that it can improve the precision of grayscale of display as well as extend the lifetime of OLED material.Except for the pixel array,low power row driver,column driver and other functional modules were also integrated on the chip.Several techniques were adopted to reduce the power consumption and frequency requirement of the chip,Finally,a 16×3×12 resolution chip was fabricated with standard 0.35 μm CMOS process of CSM and the chip can operate correctly.

【Abstract】 A low power 640×480 OLED-on-silicon chip design that used in microdisplay was presented.A novel pixel circuit was proposed to meet the special requirement of OLED-on-silicon.The novel pixel consists of three transistors and one capacitor(3T1C).It has simple structure and can effectively reduce the current glitch generated during the AC driving from 55 μA to 7.5 μA,so that it can improve the precision of grayscale of display as well as extend the lifetime of OLED material.Except for the pixel array,low power row driver,column driver and other functional modules were also integrated on the chip.Several techniques were adopted to reduce the power consumption and frequency requirement of the chip,Finally,a 16×3×12 resolution chip was fabricated with standard 0.35 μm CMOS process of CSM and the chip can operate correctly.

【基金】 Project(10ZCKFGX00200) supported by the Tianjin Science and Technology Supporting Plan,China;Project supported by the Fundamental Research Funds for the Central Universities of China
  • 【文献出处】 Journal of Central South University ,中南大学学报(英文版) , 编辑部邮箱 ,2012年05期
  • 【分类号】TN312.8
  • 【被引频次】5
  • 【下载频次】98
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