【摘要】 针对等离子刻蚀AlSiCu表面质量差、易被腐蚀、铜残留等问题,对采用等离子刻蚀的圆片进行烘焙以及使用混合溶液对圆片进行处理等方式,解决了AlSiCu腐蚀、铜残留以及表面发雾等圆片表面质量问题,得到了优化的AlSiCu刻蚀表面质量控制条件。使用优化刻蚀工艺条件,极大地提升了用AlSiCu作金属互连的模拟IC的表面镜检合格率,为其他金属互连的表面质量控制提供了参考。更多还原

【Abstract】 Aiming at the poor quality of plasma-etched AlSiCu surface and problems of erosion and copper residue,baking and cleaning with mixed solution were carried out on plasma etched wafers.By using these methods,problems of surface quality,such as erosion of AlSiCu,copper leftover and misty surface,were solved,and optimized conditions to control surface quality was obtained.By using the optimized process,pass rate of surface quality inspection on ICs with AlSiCu was significantly improved.The proposed method could provide a reference for surface quality control of other metal interconnects.更多还原