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组件的模态分析和随机振动分析

Modal Analysis and Random Vibration Analysis on a Module

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【作者】 李勤建高翠琢边国辉

【Author】 Li Qinjian,Gao Cuizhuo,Bian Guohui(The 13th Research Institute,CETC,Shijiazhuang 050051,China)

【机构】 中国电子科技集团公司第十三研究所

【摘要】 论述了用ANSYS有限元分析软件对组件进行模态分析和随机振动分析的方法。通过模态分析确定了部件的振动特性即固有频率和振型,它是其他动力分析如频谱分析的起点。通过随机振动分析确定了结构随机振动载荷的结构响应,通过随机振动分析得到结构的3σ定向变形、3σ定向加速度响应、3σ等效应力参数。根据振动响应中的最大应力计算结构的安全裕度,验证其设计能否成功克服共振现象和振动引起的不良效果。通过模态分析和随机振动分析可以优化结构提高可靠性、缩短研制周期。

【Abstract】 Basic methods of a modal analysis and a random vibration analysis on a module by the ANSYS finite element analysis software was presented.The vibration characteristics(natural frequencies and mode shapes of a component) were determined by the modal analysis.It can also serves as a starting point for dynamic,such as a spectrum analysis.The response of structures to random vibration loads was determined by the random vibration analysis.The 3σ directional deformation,3σ directional acceleration and 3σequivalent stress could be gained.Safety margin was computed by the maximum 3σ equivalent stress so that it was confirmed for structure to overcome resonance.The reliability of the structure was improved,and the manufacture period was shortened.

  • 【文献出处】 半导体技术 ,Semiconductor Technology , 编辑部邮箱 ,2012年10期
  • 【分类号】TN606
  • 【被引频次】18
  • 【下载频次】502
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