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氧化硅薄膜的制备和性质研究

Fabrication and Characterization of Silicon Oxide Thin Films

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【作者】 王新向嵘李野王国政姜德龙端木庆铎田景全

【Author】 WANG Xin,XIANG Rong,LI Ye,WANG Guozheng,JIANG Delong,DUANMU Qingduo,TIAN Jingquan(School of Sciences,Changchun University of Science and Technology,Changchun 130022,P.R.China)

【机构】 长春理工大学理学院

【摘要】 在室温条件下,采用反应磁控溅射方法,在硅衬底上制备氧化硅薄膜。研究了制备过程中不同氧气含量时氧化硅薄膜的生长速率、薄膜中的O/Si原子比例、表面粗糙度、薄膜的介电性能。发现薄膜的生长速率和介电常数随溅射时氧气含量的增加先增大后减小;薄膜中的O/Si原子比例随氧气含量的增加先增大,后来变化不明显,且很难达到或超过理想比例(2∶1);薄膜的粗糙度随氧气含量的增加先减小,后来基本保持不变。

【Abstract】 Silicon oxide thin films were fabricated on silicon substrate by reactive magnetron sputtering.Dependence of deposition rate,O/Si ratio,surface roughness and dielectric properties of silicon oxide thin film on oxygen concentration in sputtering was investigated.It was found that deposition rate and dielectric constant first increased and then decreased with increasing oxygen concentration,while O/Si ratio first increased and then showed no significant change with increasing oxygen concentration.And it is difficult to have an ideal O/Si ratio(2∶1).The roughness of thin film decreased and then kept constant with increasing oxygen concentration.

【基金】 吉林省科技厅青年科研基金资助项目(20080170)
  • 【文献出处】 微电子学 ,Microelectronics , 编辑部邮箱 ,2010年03期
  • 【分类号】O484.1
  • 【被引频次】3
  • 【下载频次】423
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