【摘要】 介绍了无卤阻燃剂标准,含卤阻燃剂的使用现状、各国禁卤法规以及各大公司无卤印制电路板(PCB)转换进程;详细分析了PCB中阻燃剂种类及其作用机理,并总结出阻燃剂主要通过切断燃烧三要素来源达到阻燃目的;最后综述了无卤PCB开发现状及其失效和可靠性分析现状。由于新型电子产品对PCB的性能要求愈来愈高,同时又要满足无卤无铅的环保要求,单一阻燃剂很难达到要求,因此多种阻燃剂的协同作用是目前研究的热点方向之一。目前对于使用无卤基板材料后电子产品失效及可靠性方面的参考资料较少,也是需要进一步研究的方向之一。更多还原

【Abstract】 The standard of halogen-free,the current situation of halogenated flame retardant and the related legislation are introduced.The types of flame retardant applied in PCBs and its mechanism are discussed.Fire is the result of three ingredients: heat,fuel and oxygen.Flame retardants inhibit or suppress the combustion process by cutting off those three ingredients.At last,the status of halogen-free PCB materials and the advances of failure analysis and reliability in halogen-free PCBs are presented.As the development of new electronic products require strict PCB properties and meanwhile meet the halogen-free and lead-free requirements,sole flame retardant is difficult to meet all the requirements.So synergic flame retardants system for PCB laminates is developed.At present,there is less refe-rence on failure mechanism and reliability of halogen-free PCBs.This would be one of the research topics which need get more focus.更多还原